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Socket your wafer level chip scale package using elastomer socket with superior electrical performance !! Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.35mm pitch WLCSP package. The SG25-BGA-2016 socket is designed for a 2.76mmx2.76mm package size and operates at bandwidths up to 40 GHz with less than 1dB of insertion loss (GSSG configuration). The contact resistance is typically 20 milliohms per pin. Network analyzer reflection measurements for the G-S-S-G case were taken with all except the pins under consideration terminated into 50 Ohms. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a simple swivel hardware installation method so that IC's can be changed out quickly. The SG25-BGA-2016 sockets are constructed with high performance and low inductance elastomer contactor. The temperature range is -35C to +100 C. The pin self inductance is 0.06 nH and mutual inductance of 0.019 nH. Capacitance to ground is 0.129 pF and mutual capacitance is 0.017pF. Current capacity is 2 amps per pin. |
