Stamped Spring Pin Socket User Manual
Table of Contents:
- Socket Mechanics
- Selecting a BGA Stamped pin socket PCB
- Requirements
- Thickness
- Finish
- Cleanliness
- IC and PCB Reflow Requirement
- Socket Assembly
- Backing and insulation Plate
- IC Insertion/extraction
- 5mm, 0.65mm & 0.8mm Center – BGA Stamped Contact Specification (Scale 40:1)
- 5mm, 0.65mm & 0.8mm Center – LGA/QFN Stamped Contact Specification (Scale 40:1)
- 1mm & 1.27mm Center – BGA Stamped Contact Specification (Scale 25:1)
- 1mm & 1.27mm Center – LGA/QFN Stamped Contact Specification( Scale 25:1)
- Socket Maintenance
- Dry Cleaning Procedure
- Wet Cleaning Procedure
- Heat Sink Specifications