Quickly and easily Socket your 0.8mm pitch 22×22 array, BGA484 packages on any application board with performance equivalent to direct solder version
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm interstitial pitch BGA 676 ball device. The SG-BGA-6513 socket is designed for a Intel’s Atom processor and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 27 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a simple hardware installation method so that IC’s can be changed out quickly
The SG-BGA-6513 sockets are constructed with high performance and low inductance elastomer contactor. The temperature range is -35 °C to +125 °C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin. Works with IC’s such as FCBGA676, 22x22x2.35mm with 0.8mm interstitial pitch and 37×37 ball array.
