Socket your 266 pin BGA packages on any PCB without significant performance loss and without soldering
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.65mm pitch BGA 266 pin IC’s. The SG-BGA-7335 socket is designed for 12x12mm BGA package and operates at bandwidths up to 30 GHz with less than 1dB of insertion loss. The sockets is designed to dissipate up to 4 watts with heat sinking compression screw. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 30 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a simple hardware installation method so that IC’s can be changed out quickly
The SG-BGA-7335 sockets are constructed with high performance and low inductance elastomer contactor. The temperature range is -35 C to +125 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin. Elastomer requires proper force for operation which is applied through a torque limiting driver via compression screw. Typical IC’s that can be tested using this socket have 266 balls, 12x12mm with 0.65mm pitch and 18×18 ball array.
