Socket your 0.8mm pitch 24×23 array, BGA552 packages on any application board with performance equivalent to direct solder version
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 94GHz, very low inductance and wide temperature applications. The GT-BGA-2146 socket is designed for 20.6×19 mm package size and operates at bandwidths up to 94GHz with less than 1dB of insertion loss. The socket is designed to dissipate 4.5 watts using a heat sink. The contact resistance is typically 30 milliohms per pin. The socket is mounted on the target PCB with no soldering, and uses very small real estate allowing capacitors/resistors to be placed close by. Other passive components can be placed on the back side of PCB by creating custom cutouts in the stiffener plate. The socket is constructed with swivel lid which incorporates a quick insertion method so that IC’s can be changed out quickly. To use, place the device inside the socket, place swivel lid and apply downward pressure by turning heat sink screw with proper torque.
The GT-BGA-2146 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55 °C to +160 °C. Works with IC’s such as 552 BGA, 20.6x19mm with 24×23 array and 0.8mm pitch.
