SOT23 package Power MOSFET can be installed in boards made for TO-205AF packaged MOSFET footprint, saving the cost and time of respinning the PCB.
Ironwood Electronics’ new adapter for the 3 pin TO-205AF packaged MOSFET device allow use of the equivalent product in SOIC package to be used in PCB boards developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip’s N-Channel logic level MOSFET 2N6901. These adapters use an Ironwood exclusive technology that allow high reliability and cost effective package converters from SMT devices to TO connection. The SOIC package is soldered directly to the top of the adapter and the assembly can then be plugged into the socket or soldered to the user’s target board. Package convertor consists of gold plated pins for reliable interconnection and substrate that is made of standard FR4 material.
