Board-to-Board Connector for High Speed Applications
Connectors using spring pin, elastomer and pin / socket interconnect technology provide up to 94GHz signal speed in a smallest footprint for prototype and production applications. These rugged interconnects utilize our laser-and-laminate process for rapid development and short lead-times, without expensive hard tooling. These connectors support pitches from 0.3mm to 2.54mm and height from 0.25mm to 5mm.
Connectors using elastomer interconnect provides highest bandwidth. Elastomer technology has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides compliance on both sides and with stand extreme temperature ranges. Board to board or Flex to board can be accomplished with custom footprint from 0.2mm to 1.27mm pitch. Elastomer buttons can be deployed in coaxial configuration for impedance match. The contact resistance is <30 milliohms. The operating temperature range for the elastomer is -55 °C to +160 °C.
Connectors using spring pin interconnect provides flexible height options. Spring pin interconnect provides high endurance and utilized in wide temperature applications. Spring pin used is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for various applications whereas the housing is laser cut and laminated allowing easy customization for contact location as well as mounting options. Solutions are available for 0.3mm to 1.27mm pitch with height ranging from 1mm to 5mm. The contact resistance is <30 milliohms and the current carrying capacity up to 8A. The operating temperature range for the spring pin is -55 °C to +180 °C.
Connectors using pin-clip interconnect provides pluggable options between mother and daughter board. These high performance connector consists of two modules (female socket module and male pin module). Female socket module was built with machined pins mechanically encapsulated into an assembly that matches the male pin module with similar construction. Female socket module has to be soldered to a mother board using standard RoHS soldering methods while the male pin module has to be soldered to a daughter board. When plugged together mother and daughter boards are connected and the system is function ready. The modules come with both lead and lead free solder ball types. The board-to-board connector pair requires half the force of conventional connectors from the gold plated pin-clip interface for ease of operation. The electrical path of the B2B connector from the top connection point on the male pin module to the solder ball on the female socket is 4.5 mm. These connectors passed environmental tests (MIL-STD) and qualified for various range of applications including automotive, military, communications, industrial, etc. Board-to-board connector line is available in many different pin counts with 1mm & 0.8mm pitch, and customs can be delivered in days.
