Giga-snaP BGA SMT Adapters allow affordable socketing
The new Giga-snaP line of BGA SMT adapters provide the most reliable interconnect to BGA SMT pads. These patented adapters remain attached through many solder cycles and will not warp as plastic molded parts. They also offer half the insertion force of other SMT adapters.
FEATURES AND BENEFITS
Short Contact: High bandwidth applications – 3.6GHz
Gold plated clips & terminals: Low contact resistance ≤ 15mΩ
Chip size footprint: Easy to place inductors, capacitors, resistors, etc. for tuning & increasing
bandwidth. Ideal for IC prototype & system testing & field upgradeable system designs
Epoxy over-mold & Matched CTE: No solder wicking & no substrate warping
Low insertion/extraction force: Easy operation to plug & remove module system
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