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Socket and Test your 27x27mm BGA device using extreme temperature socket !!
Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA1062 – CBT-BGA-6077. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss <1dB at 15.7 GHz and capacitance 0.097 pF. The current capacity of each contactor is 4 amps at 40°C temperature rise. Socket temperature range is -55°C to +180°C. Socket features a clamshell lid design for ease of chip replacement in production environment. It also has an integrated compression plate for vertical force actuation without distorting device position. The specific configuration of the package to be tested in the CBT-BGA-6077 is a BGA, 27x27mm, 0.8mm pitch 33×33 array with 1062 balls. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. To use, place BGA device into the socket and close the lid by snapping to the latch. Vertical force is applied by turning the compression screw. Socket was made of aluminum components for power dissipation and it can be customized for higher power dissipation by adding axial flow fan plus finned heat sink. This socket comes with thermal interface material to efficiently transfer heat from silicon die to outside ambient environment. This socket can be used for quick device screening, device characterization at extreme temperatures as well as final production test. |
