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Socket your 672 pin BGA using Extreme Temperature Socket with Superior Electrical Performance Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Altera FPGA – CBT-BGA-6052. The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 125,000 insertions. Low force eliminates ball sticking issues due to temperature testing. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 14.1 GHz and contact resistance is <16mOhms. The current capacity of each contactor is 8 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6052 is a BGA, 27x27mm, 1mm pitch, 672 position, 26×26 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint for nearby passive components. Socket uses 5 post stiffener plate to support back side of the PCB and allows passive components to be placed in between posts. This socket utilizes heat sink compression screw integrated with 12V axial flow fan for heat dissipation of 20 Watts. To use, place the BGA device into the socket base and close the socket lid assembly on to the base using the latch and turn heat sink compression screw to apply downward pressure. This socket can be used for hand test and temperature characterization as well as debugging application in FPGA development. |
