CBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS

Description: CBT-BGA529, 0.8mm pitch, 19 x 19, 23 x 23 array

Features:

• Wide temperature range (-55°C to +180°C )
• High current capability (up to 4A )
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time

CBT-BGA-6037