Description
Zero Footprint – No Lid Required – S21 Electrical Performance > 40 GHz
Open Nand Flash Interface (ONFi) specify a unique package & I/O configurations. This catalog covers the variations within the ONFi specifications. LGA & leaded devices can be tested using the HSIO Copper Pillar technology.
| Typical Applications | Ball Count – Socket size – Pitch-Product | Device Ball Diam. +/- 0.05 mm | Option with SAC 305 Solder Balls | Option with Eutectic Solder Balls | Standard – No Solder Balls |
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63 – 9.0 x 11.0 – 0.8 – Grypper | 0.45 | 105526-0097 | 105526-0090 | 105526-0082 |
| Device Press – 9.0 x 11.0 | 103864-0048 | ||||
| Stencil MOQ (10) | N/R | N/R | 104553-0083 | ||
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|
100 – 12.0 x 18.0 – 1.0 – Grypper | 0.45 | 105526-0089 | 105526-0088 | 105526-0057 |
| Device Press – 12.0 x 18.0 | 103864-0083 | ||||
| Stencil – 100 – 12.0 x 18.0 | N/R | N/R | 104553-0133 | ||
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132 – 12.0 x 18.0 – 1.0 – Grypper | 0.50 | 104670-0040 | 104670-0043 | 104670-0032 |
| Device Press- 12.0 x 18.0 | 103864-0083 | ||||
| Stencil – 132 – 12.0 x 18.0 | N/R | N/R | 104553-0217 | ||
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|
152 – 14.0 x 18.0 – 1.0 – Grypper | 0.50 | 104670-0041 | 108656-0036 | 104670-0036 |
| Device Press – 14.0 x 18.0 | 103864-0116 | ||||
| Stencil – 152 – 14.0 x 18.0 | N/R | N/R | 104553-0248 | ||
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|
272 – 14.0 x 18.0 – 0.8 – Grypper/G80 | 0.55 | 107206-0052 | 107206-0016 | 107206-0013 |
| Device Press – 14.0 x 18.0 | 103864-0116 | ||||
| Stencil – 272 – 14.0 x 18.0 | N/R | N/R | 104553-0354 | ||
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|
316 – 14.0 x 18.0 – 0.8 – Grypper/G80 | 0.50 | 107088-0011 | 107088-0012 | 107088-0010 |
| Device Press – 14.0 x 18.0 | 103864-0116 | ||||
| Stencil – 316 – 14.0 x 18.0 | 104553-0289 | ||||
Options: With Solder balls: SAC 305 or Eutectic !
Actual device measurements should be reviewed to ensure proper fit with socket contacts.
Extraction Tool: 105900-0004 
Reference JEDEC and ONFi Specifications; JEDEC – JESD230 and ONFi 3.2 Standards for standard device pin configurations.
