High Performance IC Sockets and Adaptors:
  • An economical and reliable alternative to soldering BGA devices directly to the motherboard.
  • Same footprint as BGA device.
  • Compact, low-profile design maximizes PC board space.
  • Ironwood has Fastest Delivery.
  • Soldering Very Similar to Soldering IC Package.
  • PCB can be reflowed with Giga-snaP.
  • Access to BGA Pads for Test & Interconnection.
  • Pin Counts from 36 to 1936.
  • Available Pitches from 1.27, 1, 0.8 mm.
  • Smaller Pitch Adaptor In Development.
  • Connection via Gold-Plated Terminals.
  • Soldered Using Conventional BGA Method.

 

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