Industry’s Smallest Footprint Up to 500,000 insertions Bandwidth up to 50+ GHz 2.5mm per side larger than IC Ball Count over 5000, Body Size 2 – 100mm < 25 mOhm Contact Resistance -55°C to +180°C 4A to 8A @80°C BGA, LGA, QFN, QFP and SOIC Optional heatsinking to 400W Six different Lid Options Quick Turn […]

High Speed Microwave Applications Contact resistance < 30 mOhms Bandwidth > 94GHz @-1 dB Current 5.4A @ 20C rise Force 25-50 grams per contact Operating temperature -55 to + 160 °C Insertion / Extraction cycles > 1000 Contact lenght (compressed): 0.08mm Compliance: 0.15mm ©2020 Ironwood Electronics. All rights reserved

Industry’s Smallest Footprint Up to 500,000 insertions ARM Bandwidth to 75 GHz 2.5mm per side larger than IC Ball Count over 4400, Body Size 2 – 100mm < 25 mOhm Contact Resistance throughout life Five different contactor options Optional heatsinldng to 300W Six different Lid Options ©2020 Ironwood Electronics. All rights reserved

Industry’s Smallest Footprint Up to 500,000 insertions Bandwidth up to 75 GHz 2.5mm per side larger than IC Ball Count over 4400, Body Size 2 – 100mm Five different contactor options Optional heatsinking to 400W Six different Lid Options < 25 mOhm Contact Resistance throughout life ©2020 Ironwood Electronics. All rights reserved

Socket and Test your 13x13mm BGA device using extreme temperature socket Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA361 – CBT-BGA-7056. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the […]

Quick-Turn Custom Designs Bandwidths to 75 GHz Industry’s Smallest Footprint Ideal for Prototype and Test Simulation Models Available Multi Level Stacked Sockets Five different contactor options BGA and QFN Sockets for all Xilinx, Microsemi, & Intel Chips SMT Options ©2020 Ironwood Electronics. All rights reserved