Shortest spring pin, 1.65mm compressed height, provides highest electrical bandwidth 60GHz with lowest inductance of 0.3nH along with 2A continuous current carrying capacity. Clamshell lid with compression screw allows gradual pressure to BGA with easy chip replacement functionality.
Quickly and easily Socket your 0.8mm pitch 14×14 array, BGA196 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55°C to +160°C
Constructed with stamped spring pin technology with copper compression plate for heat dissipation along with thermocouple location for monitoring temperature. With swivel lid operation, it is easy to swap the device and characterize. High Performance Sockets & Adapters ©2023 Ironwood Electronics. All rights reserved
Ironwood Grypper sockets are great for enabling fast easy swap out of BGA device for development sorting and failure analysis. The Grypper socket allow you to simply snap in the BGA device into the socket – No Lid needed. The Grypper sockets are the same size as the device ,”ZERO FOOTPRINT SOCKET”, so they will […]
Ironwood Electronics has released a new product group called, Thermal Socket, specifically supporting the test of high power devices. These thermal sockets utilize water-cooled solutions. There are a few different types of water-cooled solutions. Closed-loop all in one coolers is the better choice since they are pre-assembled and sealed units that include a pump, water […]
Socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -55 °C to +150 °C. The pin self inductance is 0.10 nH and mutual inductance of 0.007 nH. Capacitance to ground is 0.069 pF. Current capacity is 4 amps per pin and operates at bandwidths up to 40 GHz with […]
With lever operated mechanism quickly and easily socket your 0.92mm pitch, 56x45mm size with 3184 contacts on any development platform with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C along with liquid cooled lid that dissipates 300 watt power.
GT sockets are ideal for prototyping and testing almost any BGA device application that requires high signal integrity. This new elastomer technology has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides high compliance and works in extreme temperature ranges.
Quickly and easily Socket your 1mm pitch 28×28 array, BGA783 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55 °C to +160 °C.
Spring pin socket with 2.5 Watt heat dissipation through heat sink and fan. It also features low force 14g per contact spring pin along with high bandwidth 31.7GHz for high speed applications. Clamshell lid with compression heatsink screw allows gradual pressure to WLCSP.
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