Grypper Sockets for smaller footprint BGA-154b package Ironwood Electronics Ironwood continues to design new solutions using the Grypper socket technology for the newer smaller footprint devices released in the Open NAND Flash Interface (ONFi) 5.0 specification. The socket is surface mounted using standard soldering methods to the same location on the PCB. The Grypper requires […]

Socket your LGA1156 using Extreme Temperature Socket with Superior Electrical Performance Ironwood Electronics recently introduced a new LGA socket addressing high performance requirements for 1mm pitch LGA1156 – CBT-LGA-5036. The contactor is a stamped spring pin with 19 gram actuation force per pin and cycle life of 125,000 insertions. The self inductance of the contactor […]

Socket your 17x17mm, 1mm pitch LGA packages on target board with performance equivalent to direct solder version Ironwood Electronics has recently introduced a new LGA socket design using high performance elastomer capable of 94 GHz, very low inductance for test applications. The GTP-LGA-1003 socket is designed for 17×17 mm package size, 16×16 array, 1mm pitch and operates […]

Socket and Test your 208 lead Quad Flat pack device using extreme temperature socket Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing 208 lead Quad flat pack – CBT-QFE-3028. The contactor used in CBT-QFE-3028 socket is a stamped spring pin with 17 gram actuation force per ball […]

When an interconnection network is inserted within a transmission line between an IC device and the attaching PCB, the connectors used must provide superior electrical performance while also meeting a range of mechanical requirements. Integrated circuits have transformed electronic device design. Integrated circuits, also called ICs or semiconductor devices, have enabled designers to continually increase […]

Quickly and easily Socket your 0.8mm pitch 22×22 array, BGA484 packages on any application board with performance equivalent to direct solder version Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm interstitial pitch BGA 676 ball device. The SG-BGA-6513 socket is designed for a Intel’s Atom processor and operates at bandwidths […]

Quickly and easily Socket your 0.8mm pitch 22×22 array, BGA484 packages on any application board with performance equivalent to direct solder version Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 94GHz, very low inductance and wide temperature applications. The GT-BGA-2159 socket is designed for 19×19 mm package size […]

Socket your BGA24 using Extreme Temperature Socket with Superior Electrical Performance Ironwood Electronics recently introduced a new socket addressing high performance requirements for testing NAND Flash memory devices – SBT-BGA-6572. The contactor is a stamped spring pin with 31 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the […]

Quickly and easily Socket your 0.65mm pitch 43×43 array, BGA1113 packages on any application board with performance equivalent to direct solder version Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 94GHz, very low inductance and wide temperature applications. The GT-BGA-2154 socket is designed for 29×29 mm package size […]