Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use of semiconductor devices. IC packages covered include QFN, BGA, SOIC, QFP, LGA, WLCSP and other SMT packages. Our GHz line of sockets with 6 different contact technologies supports up to 110 GHz bandwidth, >=0.2mm pitch, <=10000 pins, 500K insertions and […]
GHz elastomer, spring pin and other socket technologies can accommodate different lid options depending upon the application requirement. Typical choices are swivel-lid, clam-shell, double-latch, integral heat-sink, etc. Custom lid solutions are also available. Swivel Lid Heatsink Compression Screw Clam Shell Lid with Compression Screw […]
Shortest spring pin, 1mm compressed height, provides highest electrical bandwidth 60GHz with lowest inductance of 0.17nH along with 2A continuous current carrying capacity. Quarter turn spring loaded lid allows gradual pressure to CSP with easy chip replacement functionality.
Ironwood introduces high performance near zero footprint elastomer socket Ironwood Electronics NEW Near Zero elastomer socket (NZGT) combines high performance elastomer technology with surface mount option enabling minimal footprint with bandwidth >43GHz. The GT high performance elastomer contact can support much higher bandwidth, but requires a footprint with mounting/alignment holes. NZGT technology utilizes high […]
Shortest spring pin, 1mm compressed height, provides highest electrical bandwidth 60GHz with lowest inductance of 0.17nH along with 2A continuous current carrying capacity. Quarter turn spring loaded lid allows gradual pressure to CSP with easy chip replacement functionality.
Quickly and easily socket your optoelectronic module (BGA64, 0.45mm pitch, 7.7x10mm size) and verify the performance equivalent to direct solder version using a high performance spring pin with low inductance of 0.17nH that operates from -40°C to +120°C.
Shortest spring pin, 1.65mm compressed height, provides highest electrical bandwidth 60GHz with lowest inductance of 0.3nH along with 2A continuous current carrying capacity. Clamshell lid with compression screw allows gradual pressure to BGA with easy chip replacement functionality.
Quickly and easily Socket your 0.8mm pitch 14×14 array, BGA196 packages on any application board with performance equivalent to direct solder version using high speed and low inductance elastomer that operates from -55°C to +160°C
Constructed with stamped spring pin technology with copper compression plate for heat dissipation along with thermocouple location for monitoring temperature. With swivel lid operation, it is easy to swap the device and characterize. High Performance Sockets & Adapters ©2023 Ironwood Electronics. All rights reserved
Ironwood Grypper sockets are great for enabling fast easy swap out of BGA device for development sorting and failure analysis. The Grypper socket allow you to simply snap in the BGA device into the socket – No Lid needed. The Grypper sockets are the same size as the device ,”ZERO FOOTPRINT SOCKET”, so they will […]
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