Ironwood Electronics offers high performance test sockets and adapters for both engineering and production use of semiconductor devices. IC packages covered include QFN, BGA, SOIC, QFP, LGA, WLCSP and other SMT packages. Our GHz line of sockets with 6 different contact technologies supports up to 110 GHz bandwidth, >=0.2mm pitch, <=10000 pins, 500K insertions and […]
Socket your 10x10mm, 0.5mm pitch LGA packages on ATE board with performance equivalent to direct solder version Ironwood Electronics has recently introduced a new LGA socket design using high performance elastomer capable of 94 GHz, very low inductance for ATE applications. The GTP-LGA-1002 socket is designed for 10×10 mm package size and operates at bandwidths up […]
Overview Company Overview – Founded 1986 – Over 10,000 catalog products – High Performance Adapters and Sockets – Many Custom Designs & Turn-Key Solutions – Engineering – Electrical and Mechanical – ISO9001:2015 Registration – Customers – Engineering and OEM Capabilities Overview – Simulation QFIN for heat sink design Microwave Studio for electrical – 3D Solid […]
Quickly and easily Socket your 35x35mm, 0.8mm pitch BGA1764 packages on any PCB without significant performance loss Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch, 1764 pin BGA IC’s. The SG-BGA-6503 socket is designed for IC size –35x35mm package size and operates at bandwidths up to 27 GHz with […]
Ironwood Electronics continues to provide Grypper test solutions as the world is rapidly shifting to mobile 5G devices, which will support immense amounts of data The 297 BGA socket is one of many newer LPDDR4X and LPDDR5 Grypper test sockets. This socket uses the Grypper contacting technology that allows the test socket to be placed […]
Company Overview – Over 8,000 products – High Performance Adapters and Sockets – Many Custom Designs – Engineering – Electrical and Mechanical – ISO 9001:2015 Registration Socket Technology Overview – Embedded gold plated wire elastomer (SG) – Stamped & Etched spring pins (SBT) – Embedded silver ball elastomer matrix (SM/SMP) – Compressible silver button in […]
High-performance, 0.35mm-0.5mm pitch net zero package footprint engineering test sockets for BGA style packaged devices Ironwood Electronics Grypper series test socket is the next best thing to not having a socket at all. The Grypper G40 as the superior test socket solution for low-to-high-ball-count BGA packages. Sized to match the package, the G40 Grypper test […]
High Performance Near Zero Footprint Sockets for 0.40 + pitch devices. New Y contact is less aggressive to device solder ball allowing multiple insertions of the same deviceLower insertion – positive retention with spring bias Lid. Technical Documents Grypper Y Specification Sheet Grypper Y RF Test Report Grypper Attach & Removal Grypper Insert & Removal […]
High-performance, 0.65 mm+ pitch net zero package footprint engineering test sockets for BGA style packaged devices over 200 ball count and for over 300 the G80 LIF to reduce insertion forces. Technical Documents Grypper G80 Specification Sheet Grypper G80 LIF Grypper G80 0.45 Ball 0.8 Pitch RF Characterization Summary Grypper G80 0.50 Ball 0.8 and […]
High Performance, Industry Standard Zero Footprint Sockets for 0.35 + pitch devices. Technical Documents Zero Footprint SMT Spring Pin Sockets Product Bulletin Ironwood Electronics Zero footprint (ZFP) sockets is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with […]
Aereospace
Agriculture
Automotive
Automation
Consumer
Device
EDP
Electric Vehicle
Equipments
Lighting
Marine
Medical
Military
Railway
Renewable Energy
System
Telecom
Wireless