GT is a new elastomer technology that has silver particles held in a conductive column like buttons which are embedded in a nonconductive polymer substrate on a proper pitch that provides high compliance and extreme temperature ranges. GT is available for BGA, LGA, QFN, PoP and other packages from 0.15mm to 1.27mm pitch.
Ironwood's GT sockets are ideal for prototyping and testing almost any BGA or QFN device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 75GHz) and supports BGA or QFN packages with pitches down to 0.15mm was utilized in these sockets. […]
Ironwood Electronics has recently introduced a new high performance QFN socket for 0.5mm pitch QFN40. The CG-QFN-7009 socket is designed for 6X6 mm package size and operates at bandwidth up to 10 GHz with less than 1dB of insertion loss. The socket is designed with easy open single latch snap lid with integrated spring loaded […]
Amphenol LTW (ALTW) unveils its field installable M12 screw terminal connectors in straight and right-angled versions. It makes a gastight connection with IP67 rated waterproof when mated. Meanwhile, the screw termination provides optimum protection under strong mechanical and thermal load. It ensures a secure and vibration-proof connection. M12 connectors are a mainstream in the industrial control system, machine-building, broadband wireless access […]
Hi-Reliability Ultra Low Profile Carrier Socket Assemblies · Eliminate hand loading individual terminals · Prevents Contact Contamination During Soldering · Available in Any Configuration Carrier Socket Assemblies carry low profile terminals through your soldering process to provide a space saving perfectly pependicular, coplanar, and substrateless socket after soldering. After assembly, the carrier is either discarded or send back to factory […]
ANDON SOLDER FORM SOCKETS™ • Solder preforms are assembled under the head of the socket terminal for low profile accurate solder volume and placement on your PCB • Cost savings by eliminating the need to apply flux or solder paste stencils. • Further cost savings by using removable carried sockets. Great reduction in hand labor […]
Xilinx XC6SLX16-2CSG324C can be used on an existing Xilinx XCV300-4PQG240I 240 position QFP SMT lands via cost effective leadless adapter. Ironwood Electronics' new Xilinx device converter – DC-BGA-XC6SLX16/QFP-XCV300-01 allows customers to use a low cost Xilinx Spartan-6 family embedded FPGA with optimized logic and High speed serial connectivity in place of Xilinx Virtex XCV300-4PQG240I FPGA. These device […]
Loranger Offers Test and Burn-in Sockets with 0.22 mm and Greater Pitches !! As more and more semiconductor components are produced in smaller packages with finer pitches, equally detailed socket manufacturing is required. Loranger has met our customer’s requirements for fine pitched sockets with advanced APS sockets. Loranger sockets are designerd with contact pitches down […]
Quickly and easily Socket your 27x27mm, 0.8mm pitch BGA packages on any application board with performance equivalent to direct solder version !!
Quickly and easily Socket your 10x10mm, 0.5mm pitch QFN packages on any application board with performance equivalent to direct solder version !! Ironwood Electronics has recently introduced a new QFN socket design using high performance elastomer capable of 40 GHz, very low inductance, high endurance and wide temperature applications. The SMP-QFN-8008 socket is designed for […]
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