CBT-LGA-5xxx Stamped Spring Pin LGA Sockets 1-10 · Ironwood

Stamped Spring Pin Sockets (SBT/CBT)

SBT BGA sockets simplify lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin. SBT QFN sockets with wide temperature range are available in the same footprint as elastomer QFN sockets.

CATALOG

Description

Stamped Spring Pin Sockets

Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.4mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.

 PART
NUMBER 
 RoHS  Top
Pitch (mm)
 Max
Pincount
 IC Size
X (mm)
 IC Size
Y (mm)
 IC
Array X
 IC
Array Y
 IC Size
Tol.ce (mm)
 CBT-LGA-5000   yes   0.75   110   25   21   30   30   0.15 
 CBT-LGA-5001   yes   6.795   10   31.777   31.777   2   5   0.15 
 CBT-LGA-5002   yes   20.32×17.78   24   31.75   31.75   4   6   0.15 
 CBT-LGA-5003   yes   0.75   110   25   21   30   30   0.15 
 CBT-LGA-5004   yes   1   675   27   27   26   26   0.3 
 CBT-LGA-5006   yes   0.6/1   108   12   12   18   18   0.15 
 CBT-LGA-5007   yes   0.5   162   11.5   13   10   20   0.08 
 CBT-LGA-5008   yes   0.8   45   4.3   7.6   5   9    
 CBT-LGA-5009   yes   0.6/1   108   12   12   18   18   0.15 
 CBT-LGA-5010   yes   1   675   27   27   26   26   0.3 
 CBT-LGA-5012   yes   1.2   416   58   47         0.1 
 CBT-LGA-5013   yes   1   625   29   29   25   25    
 CBT-LGA-5015   yes   0.514   49   3.6   3.6   7   7    
 IC Total
H. Max (mm)
 Pad
D. max (mm)
 Backing
Plate
 Max
Pkg Code
 Cavity
Down
 IC Top
Surface
 Socket
Lid
 Heat
Sink
 Part
Description
 1   0.6 x 0.5   yes   LGA110   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 10.353   4.572 x 1.522   yes      no  Components  Clam shell   no   Stamped pin Burn-in socket 
 0.71   2.032×1.524   no   LGA24   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 1   0.6×0.5   yes   LGA110   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 2.8   0.6   yes   LGA675     Mold Cap  Clam shell   no   Stamped pin Burn-in socket 
 0.98   0.25   yes   LGA108   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 0.71   0.3   yes   LGA162   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 1.45   0.4×0.4   yes   LGA45   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 0.98   0.11   yes   LGA180   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 2.8   0.6   yes   LGA675   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 2.97   0.6   yes   LGA416   no  Components  Clam shell   no   Stamped pin Burn-in socket 
 3.41   0.68   yes   LGA625   no   Flat   Clam shell   no   Stamped pin Burn-in socket 
 0.35   0.275      LGA49   no   Flat   Snap lid   no   Stamped pin Burn-in socket