Description
Ironwood’s GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint).
PART NUMBER |
ROHS | Top Pitch (mm) |
Max Pincount |
IC Size X (mm) |
IC Size Y (mm) |
IC Size Tol. (mm) |
IC Array X |
IC Array Y |
GT-BGA-2000 | yes | 0.8 | 100 | 9 | 9 | 10 | 10 | |
GT-BGA-2001 | yes | 1 | 189 | 18 | 18 | 0.2 | 17 | 17 |
GT-BGA-2002 | yes | 0.8 | 625 | 21 | 21 | 0.2 | 25 | 25 |
GT-BGA-2003 | yes | 1 | 1369 | 37.5 | 37.5 | 0.1 | 37 | 37 |
GT-BGA-2004 | yes | 0.8 | 715 | 27 | 27 | 0.2 | 32 | 32 |
GT-BGA-2005 | yes | 1 | 64 | 9 | 9 | 0.07 | 8 | 8 |
GT-BGA-2006 | yes | 1 | 256 | 17 | 17 | 0.2 | 16 | 16 |
GT-BGA-2010 | yes | 1 | 1760 | 42.5 | 42.5 | 0.2 | 42 | 42 |
GT-BGA-2015 | yes | 0.5 | 361 | 10 | 10 | 0.15 | 19 | 19 |
GT-BGA-2016 | yes | 0.8 | 602 | 23 | 23 | 0.2 | 28 | 28 |
GT-BGA-2017 | yes | 1 | 1156 | 35 | 35 | 0.2 | 34 | 34 |
GT-BGA-2018 | yes | 0.5 | 336 | 9 | 10.5 | 0.1 | 17 | 20 |
GT-BGA-2019 | yes | 1 | 572 | 25 | 25 | 0.1 | 24 | 24 |
GT-BGA-2020 | yes | 0.8 | 361 | 16 | 16 | 0.2 | 19 | 19 |
GT-BGA-2021 | yes | 0.5 | 132 | 4.275 | 4.575 | 0.025 | 11 | 12 |
GT-BGA-2022 | yes | 0.3 | 368 | 8 | 8 | 0.1 | 23 | 23 |
GT-BGA-2023 | yes | 1 | 2028 | 43 | 59 | 0.05 | 41 | 57 |
GT-BGA-2024 | yes | 0.4 | 54 | 2.64 | 3.94 | 0.025 | 6 | 9 |
GT-BGA-2025 | yes | 0.8 | 484 | 19 | 19 | 0.1 | 22 | 22 |
GT-BGA-2026 | yes | 1 | 256 | 17 | 17 | 0.2 | 16 | 16 |
IC Ball H. Min mm |
IC Ball H. Max mm |
IC Total H. Max mm |
IC Ball Copl.ty mm |
IC Ball Dia. Max mm |
Backing Plate |
Cavity Down |
IC Top Surface |
Socket Lid |
Heat Sink |
Part Description |
0.25 | 0.35 | 1.1 | 0.1 | 0.45 | included | no | Flat | Swivel | no | BGA socket |
0.4 | 0.6 | 2.5 | 0.2 | 0.7 | included | no | Flat | Swivel | no | BGA socket |
0.27 | 0.45 | 1.7 | 0.15 | 0.55 | included | no | Flat | Swivel | no | BGA socket |
0.4 | 0.6 | 3.01 | 0.2 | 0.7 | included | no | Flat | Swivel | no | BGA socket |
0.3 | 0.5 | 2.5 | 0.25 | 0.55 | included | no | Flat | Swivel | no | BGA socket |
0.4 | 0.6 | 1.3 | 0.15 | 0.7 | included | no | Flat | Swivel | no | BGA socket |
0.4 | 0.6 | 3.02 | 0.25 | 0.7 | included | no | Flat | Swivel | no | BGA socket |
0.4 | 0.6 | 3.36 | 0.7 | included | no | Flat | Swivel | no | BGA socket | |
0.13 | 0.27 | 1.2 | 0.08 | 0.35 | included | no | Flat | Swivel | no | BGA socket |
0.3 | 0.5 | 2.766 | 0.2 | 0.6 | included | no | Mold Cap | Swivel | no | BGA socket |
0.4 | 0.6 | 3.16 | 0.2 | 0.7 | included | no | Flat | Swivel | no | BGA socket |
0.2 | 0.3 | 1.4 | 0.1 | 0.3 | included | no | Flat | Swivel | no | BGA socket |
0.4 | 0.6 | 2.173 | 0.2 | 0.74 | included | no | Mold Cap | Clam shell | yes | BGA socket |
0.16 | 0.26 | 1.22 | 0.1 | 0.35 | included | no | Flat | Swivel | no | BGA socket |
0.17 | 0.2 | 2 | 0.05 | 0.3 | included | no | Flat | Swivel | no | BGA socket |
0.06 | 0.16 | 1 | 0.08 | 0.23 | included | no | Flat | Swivel | no | BGA socket |
0.6 | 4.608 | included | yes | Metal Lid | Sliding | yes | BGA socket | |||
0.164 | 0.223 | 0.65 | 0.08 | 0.293 | included | no | Flat | Clam shell | no | BGA socket |
0.3 | 0.5 | 2.74 | 0.7 | included | no | Mold Cap | Clam shell | no | BGA socket | |
0.4 | 0.6 | 3.02 | 0.25 | 0.7 | included | no | Flat | Swivel | no | BGA socket |