GT Elastomer BGA Sockets 21-40 · Ironwood

GT Elastomer BGA Sockets

GT is a new elastomer technology that has silver particles held in a conductive column like buttons which are embedded in a non-conductive polymer substrate on a proper pitch that provides high compliance and extreme temperature ranges. GT is available for BGA, PoP and other packages from 0.2mm to 1.27mm pitch. The contact resistance is <30 milliohms. The operating temperature range for the elastomer is -55 °C to +160 °C.

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Description

Ironwood’s GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint).

PART NUMBER	RoHS	Top Pitch (mm)	Max Pincount	IC Size X (mm)	IC Size Y (mm)	IC Size Tolerance (mm)	IC Array X	IC Array Y
GT-BGA-2028	yes	1	324	19	19	0.2	18	18
GT-BGA-2029	yes	1	1156	35	35		34	34
GT-BGA-2030	yes	1.27	400	27	27	0.2	20	20
GT-BGA-2031	yes	0.5	270	7.911	9.331	0.2	15	18
GT-BGA-2032	yes	0.75	365	15	15		27	27
GT-BGA-2033	yes	1	208	17	17	0.2	16	16
GT-BGA-2034	yes	0.8	257	14	14	0.1	17	17
GT-BGA-2035	yes	1	1156	35	35	0.2	34	34
GT-BGA-2036	yes	0.65	621	17	17	0.2	25	25
GT-BGA-2037	yes	0.8	529	19	19	0.2	23	23
GT-BGA-2038	yes	1	1517	40	40	0.2	39	39
GT-BGA-2039	yes	0.5	68	10.5	8.5		20	16
GT-BGA-2041	yes	1	1024	33	33	0.2	32	32
GT-BGA-2042	yes	1	784	29	29	0.2	28	28
GT-BGA-2043	yes	1	2397	50	50	0.07	49	49
GT-BGA-2044	yes	0.8	752	19	19	0.2	23	23
GT-BGA-2046	yes	0.4	180	6.066	4.866	0.03	15	12
GT-BGA-2047	yes	0.4	105	4.46	4.06	0.03	11	10
GT-BGA-2049	yes	0.8	625	21	21	0.1	25	25
GT-BGA-2050	yes	1	2104	47.5	47.5	0.2	46	46

IC Ball H. Min mm	IC Ball H. Max mm	IC Total H. Max mm	IC Ball Copl.ty mm	IC Ball D. Max mm	Backing Plate	Cavity Down	IC Top Surface	Socket Lid	Heat Sink	Part Description
0.47	0.58	2.99	0.2	0.7	included	no	Flat	Swivel	yes	BGA socket
0.78	0.98	3.083		0.7	included	no	Mold Cap	Swivel	no	BGA socket
	0.66	2.375	0.2	0.762	included	no	Flat	Swivel	no	BGA socket
0.212	0.288	0.593	0.03	0.36	included	no	Flat	Swivel	no	BGA socket
0.35	0.45	1.18		0.53	included	no	Flat	Swivel	no	BGA socket
0.4	0.6	3.02	0.27	0.7	included	no	Flat	Clam shell	no	BGA socket
0.2	0.34	1.18		0.45	included	no	Flat	Swivel	no	BGA socket
0.4	0.6	3.5	0.2	0.7	included	no	Flat	Swivel	no	BGA socket
0.2		2.5	0.2	0.45	included	no	Mold Cap	Open top	no	BGA socket
0.2		3	0.15	0.6	included	no	Flat	Open top	no	BGA socket
0.4	0.6	3.51	0.2	0.7	included	no	Flat	Swivel	no	BGA socket
0.3		1.5			no	no	Flat	Open Top	no	BGA socket
0.4	0.6	3.142	0.15	0.6	included	no	Flat	Screws	yes	BGA socket
0.4	0.6	3.142	0.15	0.7	included	no	Flat	Screws	yes	BGA socket
0.4	0.52	3.708		0.707	included	no	Flat	Swivel	no	BGA socket
0.25		2.5	0.2	0.5	included	no	Flat	Swivel	no	BGA socket
0.16	0.22	0.6	0.05	0.3	included	no	Flat	Swivel	no	BGA socket
0.16	0.23	1	0.03	0.3	included	no	Flat	Swivel	no	BGA socket
0.36	0.44	3.43	0.12	0.55	included	no	Flat	Swivel	no	BGA socket
0.4	0.6	4.31	0.2	0.7	included	no	Flat	Swivel	no	BGA socket