Description
Ironwood’s GTP sockets are ideal for prototyping and production testing almost any BGA, QFN, or LGA device application. These IC sockets provide excellent signal integrity and high mechanical endurance. Innovative elastomer interconnect technology, that delivers low signal loss (1dB at 94GHz) and supports BGA, QFN, and LGA packages with pitches down to 0.35mm. With the addition of proprietary gold crown, our GTP sockets are also able to deliver greater than 200,000 cycles, when properly configured. GTP sockets are mechanically mounted over a target system’s lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint).
PART NUMBER |
RoHS | Top Pitch (mm) |
Max Pin count |
IC Size X (mm) |
IC Size Y (mm) |
IC Size Tolerance (mm) |
IC Array X |
IC Array Y |
GTP-LGA-1001 | yes | 0.5/0.55 | 88 | 7 | 7 | 0.15 | 11 | 4 |
IC Total Height Max (mm) |
IC Ball Copl.ty (mm) |
Pad Diameter Max (mm) |
Backing Plate |
Cavity Down |
IC Top Surface |
Socket Lid |
Heat Sink |
Part Description |
0.8 | 0.08 | 0.25×0.3 | yes | no | Flat | Swivel | no | GT LGA Socket |