SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET

Description: BGA256E6 1mm pitch, 17x17mm, 16×16 Array, Socket Assembly

Features:

• Wide temperature range (-55°C to +180°C)
• High current capability (up to 4A)
• Excellent signal integrity at high frequencies
• Low and stable contact resistance for reliable production yield
• Highly compliant to accommodate wide co-planarity variations
• Automated probe manufacturing enables low cost and short lead time

SBT-BGA-6006