SBT-BGA-8xxx (0.4mm and 0.45mm Pitch) Stamped Spring Pin Sockets 1-5 · Ironwood

Stamped Spring Pin Sockets (SBT/CBT)

SBT BGA sockets simplify lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin. SBT QFN sockets with wide temperature range are available in the same footprint as elastomer QFN sockets.

CATALOG

Description

Stamped Spring Pin Sockets

Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.4mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.

 PART
NUMBER 
 RoHS   Max
Pincount 
 Top
Pitch (mm) 
 IC
Array X 
 IC
Array Y 
 Socket
Lid 
 Cavity
Down 
 IC Top
Surface 
 Heat
Sink 
 Backing
Plate 
 SBT-BGA-8003   yes   529   0.4   23   23   Swivel   no   Flat   no   included 
 SBT-BGA-8004   yes   256   0.4   16   16   Swivel   no   Flat   no   included 
 SBT-BGA-8005   yes   169   0.45   13   13   Swivel   no   Flat   no   included 
 SBT-BGA-8007   yes   26   0.4   6   6   Swivel   no   Flat   no   included 
 SBT-BGA-8008   yes   488   0.4   28   28   Slide   no   Flat   no   included 
 IC Total
H. Max mm 
 IC Size
X mm 
 IC Size
Y mm 
 IC Size
Tol.ce mm 
 IC Ball
Copl.ty mm
 IC Ball
H. Min mm 
 IC Ball
H. Max mm 
 IC Ball
D. Max mm 
 Max
Pkg Code 
 Part
Description 
 1.25   10   10   0.1   0.08   0.15   0.25   0.3   BGA529  Stamped pin Burn-in socket 
 1   7   7   0.1   0.08   0.15   0.25   0.3   BGA256  Stamped pin Burn-in socket 
 1   6.1   6.25   0.1   0.08   0.17      0.29   BGA169  Stamped pin Burn-in socket 
 0.39   2.794   2.705   0.05   0.03   0.085   0.115   0.145   BGA26  Stamped pin Burn-in socket 
 0.8   12   12   0.1   0.08   0.13   0.23   0.3   BGA488  Stamped pin Burn-in socket