SBT-LGA-9xxx Stamped Spring Pin QFN Sockets 1-13 · Ironwood

Stamped Spring Pin Sockets (SBT/CBT)

SBT BGA sockets simplify lab and evaluation applications due to low cost and better electrical/mechanical performance than conventional pogo pin. SBT QFN sockets with wide temperature range are available in the same footprint as elastomer QFN sockets.

CATALOG

Description

Stamped Spring Pin Sockets

Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.4mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.

 PART
NUMBER 
RoHS   Top
Pitch mm
 Max
Pincount
 IC Size
X mm
 IC Size
Y mm
 IC
Array X
 IC
Array Y
 IC Size
Tol.ce mm
 SBT-LGA-9002   yes   1   52   12   17   9   13   0.1 
 SBT-LGA-9003   yes   1.27   141   15   15   12   12   0.1 
 SBT-LGA-9004   yes   1.25   174   30   40   31   23   0.1 
 SBT-LGA-9005   yes   0.5   41   5   5   8   4   0.1 
 SBT-LGA-9006   N/A   1   430   30   30   20   20   0.05 
 SBT-LGA-9007   yes   0.5   20   2.628   2.54   9   2   0.1 
 SBT-LGA-9009   yes   0.5   224   12   12   20   20   0.1 
 SBT-LGA-9010   yes   0.5   300   48   48          
 SBT-LGA-9011   yes   1   625   29   29   25   25   0.15 
 SBT-LGA-9012   yes   1.5   20   8.91   8   6   4   0.13 
 SBT-LGA-9013   yes   0.65   121   7   7   11   11   0.1 
 SBT-LGA-9014   yes   0.5   88   7   7   44   4   0.15 
 SBT-LGA-9015   yes   0.8   256   14   18   18   23   0.1 
 IC Total
H. Max mm
 Pad
D. max mm
 Backing
Plate
 Max
Pkg Code
 Cavity
Down
 IC Top
Surface
 Socket
Lid
 Heat
Sink
 Part
Description
 1.15   0.75   no   LGA52   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 2.92   0.63   no   LGA141   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 2.7   0.75   included   LGA174   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 0.98   0.25 x 0.35   included   LGA41   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 N/A   N/A   no   LGA430   N/A   N/A   N/A   N/A   Stamped pin Burn-in socket 
 1.3   0.3   no   LGA20   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 1.5   0.3   included   LGA224   no   Flat   Swivel   no   Stamped pin Burn-in socket 
       included   LGA300   no   Flat   Open top   no   Stamped pin Burn-in socket 
 2.8   0.63   included   LGA625   no   Flat   Open top   no   Stamped pin Burn-in socket 
    0.61   included   LGA20   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 0.98   0.25   no   LGA121   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 0.8      included   LGA88   no   Flat   Swivel   no   Stamped pin Burn-in socket 
 2   0.6   no   LGA256   no   Flat   Swivel   no   Stamped pin Burn-in socket