GHz-BGA DIRECT MOUNT, SOLDERLESS SOCKET

Description: SG-BGA 324pin, 19x19mm, 18×18 array, 1.0mm pitch with Heat sink

Features:

• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid

• Heat sink lid for power dissipation

SG-BGA-6266