GHz-BGA DIRECT MOUNT, SOLDERLESS SOCKET

Description: SG-BGA121C 12mm IC, 11×11 array, 1mm pitch w/ open top lid

Features:

• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Open top compression plate

SG-BGA-6457