Description
Sockets for High Bandwidth Applications
SG BGA sockets & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. It uses embedded wire in elastomer contact for transmitting signals effectively. Our sockets support pitches down to 0.3mm.
| PART NUMBER |
RoHS | Top Pitch (mm) |
Max Pincount |
IC Size X (mm) |
IC Size Y (mm) |
IC Size Tolerance (mm) |
IC Array X |
IC Array Y |
IC Ball H. Min (mm) |
| SG15-BGA-1000 | yes | 0.4 | 1156 | 14 | 14 | 0.1 | 34 | 34 | 0.15 |
| SG15-BGA-1001 | yes | 0.4 | 1292 | 14 | 15.5 | 0.1 | 34 | 38 | 0.06 |
| SG15-BGA-1002 | yes | 0.4 | 225 | 7 | 7 | 0.1 | 15 | 15 | 0.14 |
| SG15-BGA-1003 | yes | 0.65 | 134 | 10 | 11.5 | 0.1 | 10 | 17 | 0.22 |
| SG15-BGA-1004 | yes | 0.65 | 121 | 8 | 8 | 0.1 | 11 | 11 | 0.15 |
| SG15-BGA-1005 | yes | 0.65 | 81 | 6.5 | 6.5 | 0.1 | 9 | 9 | 0.2 |
| SG15-BGA-1006 | yes | 0.5 | 112 | 6 | 6 | 0.1 | 12 | 12 | 0.15 |
| SG15-BGA-1007 | yes | 0.4×0.3 | 29 | 1.74 | 2.05 | 0.1 | 5 | 6 | 0.09 |
| IC Ball H. Max (mm) |
IC Total H. Max (mm) |
IC Ball Copl.ty (mm) |
IC Ball D. Max (mm) |
Backing Plate |
Cavity Down |
IC Top Surface |
Socket Lid |
Heat Sink |
Part Description |
| 0.23 | 1 | 0.08 | 0.3 | yes | yes | Flat | Swivel | GHz BGA Socket (ZIF) | |
| 0.25 | 1.31 | 0.05 | 0.25 | yes | no | Flat | Swivel | GHz BGA Socket (ZIF) | |
| 0.24 | 0.95 | 0.08 | 0.3 | yes | no | Flat | Swivel | GHz BGA Socket (ZIF) | |
| 0.7 | 0.08 | 0.36 | no | no | Flat | Swivel | GHz BGA Socket (ZIF) | ||
| 0.25 | 1.52 | 0.08 | 0.35 | yes | no | Flat | Swivel | GHz BGA Socket (ZIF) | |
| 0.3 | 1 | 0.1 | 0.35 | yes | no | Flat | Swivel | GHz BGA Socket (ZIF) | |
| 0.8 | 0.08 | 0.35 | no | no | Flat | Swivel | GHz BGA Socket (ZIF) | ||
| 0.15 | 0.46 | 0.08 | 0.18 | yes | no | Flat | Swivel | GHz BGA Socket (ZIF) |
