SM-BGA SOCKET DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS

Description: SM-BGA Socket for 29x29mm, 1.27mm pitch, 22×22 array, BGA484

Features:

• Wide temperature range (-55°C to +150°C).
• Current capability is 4A per pin at 14°C temperature rise.
• Over 40GHz bandwidth @-1dB for edge pins
• Low and stable contact resistance for reliable production yield.
• Self inductance under 0.21nH.
• Easily removable swivel socket lid

SM-BGA-9014