Description
Package Converters & Fix Adapters
Package converters provide an electrical and mechanical conversion from one package type to another. We use gold plated interconnects for our pin and through hole converters.
Ironwood Electronics offers solder column adapters as a solution for leaded SMT packages such as QFP, PLCC, SOIC, SSOP, and TSOP. This is an excellent choice when you have a PC board in production that needs an upgrade or you need to replace an obsolete part. The solder column adapter provides a fast, highly reliable connection at a fraction of the cost of competing designs. This makes it an excellent choice for either prototype or production quantities.
The solder column adapter efficiently adapts one footprint to another footprint in a low-profile, compact design. The solder column adapter mounts directly to the SMT pads with a footprint no larger than the actual target land pattern. They are available with a 1:1 connection or a custom net list. Our state of the art design and manufacturing capabilities allow us to replace and upgrade the functions in legacy IC’s. Parts can be manufactured as RoHS or non-RoHS compliant depending on your application.
We offer products for each of the following package conversions. The part families are listed in “top interface to bottom interface” order.
PART NUMBER |
RoHS | Top Package Code |
Bottom Package Code |
Top Pin Count |
Bottom Pin Count |
Top Interface |
PC-SOIC/DIP54-05 | Call* | SO54A | 0.3 | 54 | 54 | SOIC Land Pattern |
PC-SOIC/DIP54-06 | Call* | SO54A | 0.6 | 54 | 54 | SOIC Land Pattern |
PC-SOIC/DIP56-01 | Call* | SO56G | 0.3 | 56 | 56 | SOIC Land Pattern |
PC-SOIC/DIP56-02 | Call* | SO56G | 0.6 | 56 | 56 | SOIC Land Pattern |
PC-SOIC/DIP56-03 | Call* | SO56A | 0.3 | 56 | 56 | SOIC Land Pattern |
PC-SOIC/DIP56-04 | Call* | SO56A | 0.6 | 56 | 56 | SOIC Land Pattern |
PC-SOIC/DIP56-05 | Call* | SO56E | 0.3 | 56 | 56 | SOIC Land Pattern |
PC-SOIC/DIP56-06 | Call* | SO56E | 0.6 | 56 | 56 | SOIC Land Pattern |
PC-SOIC/DIP6-01 | Call* | SO6A | 0.3 | 6 | 6 | SOIC Land Pattern |
PC-SOIC/DIP6-01W | Call* | SO6A | 0.3 | 6 | 6 | SOIC Land Pattern |
PC-SOIC/DIP64-01 | Call* | SO64A | 0.3 | 64 | 64 | SOIC Land Pattern |
PC-SOIC/DIP64-02 | Call* | SO64A | 0.6 | 64 | 64 | SOIC Land Pattern |
PC-SOIC/DIP8-01 | Call* | SO8A_S08B_SO8E | 0.3 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-01W | Call* | SO8A_S08B_SO8E | 0.3 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-02 | Call* | SO8A_SO8B | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-02W | Call* | SO8A_SO8B | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-03 | Call* | SO8C | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-03W | Call* | SO8C | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-04 | Call* | SO8A | 0.3 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-05 | Call* | SO8D | 0.3 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-06 | Call* | SO8D | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-07 | Call* | SO8G | 0.3 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-08 | Call* | SO8G | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-SOIC/DIP8-08W | Call* | SO8G | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-TSOP/DIP8-01 | Call* | SO8F | 0.6 | 8 | 8 | SOIC Land Pattern |
PC-TSOP/DIP8-01W | Call* | SO8F | 0.6 | 8 | 8 | SOIC Land Pattern |
Bottom Interface |
IC Package Lead Tip to Tip (mm) |
Bottom Array Size |
Adapter Size Length X Width (in.) |
Bottom Pitch (mm) |
Part Description |
Thru Hole Pins | 0.543 – 0.563 | N/A | 2.7 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.543 – 0.563 | N/A | 2.7 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.252 | N/A | 2.4 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.252 | N/A | 2.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.787 | N/A | 2.8 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.787 | N/A | 2.8 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.787 | N/A | 2.8 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.787 | N/A | 2.8 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.15 – 0.349 | N/A | 0.3 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.15 – 0.349 | N/A | 0.3 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.543 – 0.563 | N/A | 3.2 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.543 – 0.563 | N/A | 3.2 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.15 – 0.375 | N/A | 0.4 x 0.4 | 2.54 | SOIC to DIP Converter |
WW/Thru Hole Pins | 0.15 – 0.375 | N/A | 0.4 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.125 – 0.325 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.125 – 0.325 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.3 – 0.45 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.3 – 0.45 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.127 – 0.275 | N/A | 0.4 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.246 – 0.252 | N/A | 0.4 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.246 – 0.252 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.246 – 0.252 | N/A | 0.4 x 0.4 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.246 – 0.252 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.246 – 0.252 | N/A | 0.4 x 0.7 | 2.54 | SOIC to DIP Converter |
Thru Hole Pins | 0.125 – 0.325 | N/A | 0.7 x 0.4 | 2.54 | SOIC to DIP Converter |
WW/Thru Hole Pins | 0.125 – 0.325 | N/A | 0.7 x 0.4 | 2.54 | SOIC to DIP Converter |